According to the reports, BYD Semiconductor Co., Ltd. planned to IPO and listed on the Chinese stock exchange and had accepted CICC’s IPO guidance.
And recently completed counseling and filing with the Shenzhen Securities Regulatory Bureau. Additionally, there are industry news that BYD and Huawei have begun to cooperate in the development of Kirin chips, and new breakthroughs are expected in the near future.
In 2020, BYD’s board of directors issued an announcement stating that it agreed to the subsidiary BYD Semiconductor Co., Ltd. to prepare for the split and listing, and will start the preliminary preparations for the split of BYD Semiconductor.
In this regard, BYD said that this spin-off plan is to better integrate resources and expand and strengthen the semiconductor business.
It is worth noting that the future carrying terminal of this Kirin chip has not been disclosed, and it is speculated that it may be car equipment. Because with the development of new energy vehicles, there are higher requirements for vehicle performance.
In fact, as early as June last year, there was news that BYD and Huawei had signed a cooperation agreement to build a car-grade Kirin chip. Its first product was Kirin 710A.
It is reported that Kirin 710A was OEM and mass-produced by SMIC before that, using 14nm process technology. If BYD can realize the production of the chip, the Kirin 710A will be autonomous and controllable from design, OEM to packaging and testing.
According to data, BYD Semiconductor was established on October 15, 2004, and has now become a Chinese independent and controllable automotive-grade IGBT (insulated gate bipolar transistor) head manufacturer.
BYD hopes to rely on BYD Semiconductor’s accumulation and application in the field of automotive-grade semiconductors to gradually realize the Chinese substitution of other automotive-grade core semiconductors.
(Via)
