According to the latest report, OSAT leader ASE is expected to maintain high capacity utilization throughout 2022, supported by the expansion of automotive chip IDM outsourcing orders and long-term capacity utilization commitments from chip manufacturing customers.
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ASE’s automotive chip processing business is expected to achieve year-on-year growth of more than 40% by 2022, at least more than $1 billion, and its wire-bonding capacity for automotive microprocessors is expected to remain stable, the person said, according to Digitimes.
Major CPU and GPU suppliers including Nvidia and AMD, in addition to contracting with TSMC to manufacture their new high-end HPC and AI chips with advanced process nodes and 3D Fabric packaging solutions, will continue to invest in ASE and its Subsidiary Silicon Products placed most of the FC-BGA packaging orders for gaming GPUs and game console SoCs, further improving their capacity utilization in 2022.
According to the financial report, ASE’s revenue in March 2022 increased by 23.77% year-on-year to NT$51.986 billion (US$1.787 billion), a decrease of 16.5% month-on-month.
Its testing subsidiary, ASE Testing, and other specialized testing companies, including KYEC, Sigurd, Xinquan Technology, Jiuyuan Electronics, and TeraPower Technology, will also maintain high-end testing capacity in processing automotive MCU, HPC GPU, and CPU chips growing rapidly.
