The global packaging and testing leader ASE and its subsidiary Silicon Products have received orders for the flagship Snapdragon 8 Gen 1 chip that Qualcomm has just launched.
Moreover, Qualcomm has just released its latest flagship smartphone SoC Snapdragon 8 Gen 1, Samsung Electronics 4nm technology, IC packaging, and testing referred to the ASE, Amkor, and SPIL, mainly based carrier FCCSP technology of the board.
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Furthermore, ASE and Silicon Products maintain a close cooperative relationship with Qualcomm, providing Qualcomm with mid-to-high-end packaging and testing services for various chip solutions, including mobile SoC, PC chips, modem chips, automotive chips, network chips, and mmWave AiP modules.
The sources pointed out that Qualcomm chose Samsung Electronics to manufacture its new flagship mobile SoC, which is expected to increase its orders from TSMC in 2022. It is expected that in the next few years, ASE and other packaging and testing plants will maintain close commercial ties with Qualcomm.
