TRANSSION Infinix announced the development of an improved liquid cooling technology called ” 3D Vapor Cloud Chamber ” (3D VCC). According to the company, it reduces the temperature of the chipset by 3°C compared to traditional VC liquid cooling designs.
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Moreover, the VC of traditional mobile phones is usually flat and requires the use of thermal paste (or similar material) to match the chipset and vapor chamber. Transsion’s Infinix design team for the first time innovatively designed the dimensions of the VC shape and increased the volume, water storage capacity, and heat flux of the evaporator by adding protrusions.
The 3D VCC leaves a tiny gap between the chamber and the chipset, increasing the internal volume of the VC, meaning more coolant can be accommodated. Experiments show that 3D VCC can reduce the temperature of the chipset by 3°C and increase the heat dissipation speed by 12.5%.
Transsion said that the solution solves the high-temperature challenges of high-integration and high-power smartphones, such as CPU frequency reduction, frame rate drop, or screen freezing issues, and has been certified by the State Intellectual Property Office of China.
