At the end of the conference, Xu Qi, vice president of Realme, declared the One More Thing of this conference Realme GT Neo. Judging from the image, the device will be equipped with MediaTek’s latest flagship chip, Dimensity 1200 that is supposed to be benchmarked.
It will be unveiled on Redmi and other gaming/e-sports phones in the near future. MediaTek launched a new generation of 5G flagship SoCs-Dimensity 1200 and Dimensity 1100 on January 20. Both chips include a highly integrated 5G modem, using MediaTek UltraSave 5G technology, which has excellent energy-saving effects.
Additionally, to supporting the latest connection functions, Dimensity 1200 also supports all generations of connection functions from 2G to 5G, including (SA) independent and non-independent (NSA) 5G architecture, frequency division duplex (FDD), and time division duplex ( TDD) 5G Carrier Aggregation (2CC), Dynamic Spectrum Sharing (DSS), true dual SIM card 5G (5G SA+5G SA) and 5G HD Voice (VR).
The new generation of chipsets integrates enhancements to the 5G HSR mode and 5G Elevator mode to ensure reliable and seamless 5G connections across networks. Dimensity 1200 chip adopts TSMC 6nm process, 1 Cortex-A78 large core 3.0GHz, 3 Cortex-A78 2.6GHz, 4 Cortex-A55 2.0GHz cores, performance increase 22%, energy efficiency raise 25%.
The GPU scale has not changed much, and the performance has increased by up to 13%. The Snapdragon 888 was officially released in December last year. Qualcomm introduced the ARM super core for the first time in this 5nm processor, bringing a substantial performance upgrade.
For the first time, it integrated the Snapdragon X60 5G modem that has the world’s fastest 5G connection rate. Snapdragon 888’s AI will reach 26 trillion operations per second after adding an AI accelerator.