Electronics
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8SK Hynix is developing UFS4.0 flash memory based on 238-layer NAND: Report
According to the latest report, semiconductor industry sources revealed that SK Hynix plans to mass-produce the latest UFS 4.0 flash memory using...
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12Samsung still uses traditional hinge on Galaxy Z Fold4 / Flip4: Report
Samsung launched the Galaxy Z Fold4 / Flip4 two folding screen mobile phones. On August 11th, Motorola and Xiaomi also launched the...
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11Samsung SDI plans to establish lithium battery R&D center in US and Germany by next year
South Korean battery maker Samsung SDI said that it has established research and development (R&D) centers in the United States and Germany...
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9GlobalFoundries records 63,000 wafer shipments in Q2 2022: Report
According to Evertiq, GF CEO Dr. Thomas Caulfield said that the company shipped a new record of 630,000 wafers in the second...
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12Team Group released MP44L M.2 PCIe 4.0 SSD, has graphene aluminum foil elements
According to the official news from Team Group, it released the MP44L M.2 PCIe 4.0 SSD with breakthrough cooling application technology, which...
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8ASUS launched PA32DC professional-grade OLED display
According to the latest report, ASUS today launched the world’s first automatic color correction OLED professional display, the model is ASUS ProArt...
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7Top five silicon wafer suppliers will increase their expansion in the coming years: Report
The market for silicon wafers for semiconductor applications, including SOI wafers, will grow to $16 billion in 2022, up about 12 percent...
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12Apple iPhone 14 Pro’s latest design based on revelations
According to previous reports, Apple is expected to hold a fall new product launch event as early as September 6 this year....
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33iQOO Neo7 main camera may be upgraded to 50MP outsole IMX766V sensor
iQOO released the iQOO Neo6 SE equipped with Qualcomm Snapdragon 870, which is expected to be the last model of the iQOO...