According to the latest report, the battle between TSMC and Samsung in the 3nm process has always attracted the attention of the global semiconductor industry.
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Moreover, TSMC’s 3nm process, which was once delayed in the development schedule, has recently made a major breakthrough. The delay has caused Apple’s new generation of processors to still use the 5nm enhanced version of N4P.
It is reported that TSMC decided to take the lead in mass production of the second version of the 3nm process N3B this year. It will be synchronously cast in the eighth phase of the R&D center of the Hsinchu 12 factory and the P5 factory of the Nanke 18 factory in August this year, and officially use the fin field-effect transistor ( FinFET) architecture, against Samsung’s gate around (GAA) process.
Moreover, it was reported that TSMC’s 3nm manufacturing process will still be put into production later this year. The variant entering production is called “N3B,” and Digitims expects initial production to be between 40,000 and 50,000 units per month. After “N3B”, there will soon be an advanced variant called “N3E”, which is expected to enter production in 2023.
