With the increasingly powerful functions of a smartphone, it has become an indispensable item in daily life, and even many people have developed ‘electric phobia’.

Lately, the Beijing Institute of Space Vehicle Systems Engineering of the Rocket Academy brought you a black space technology, ‘drink more hot water’ to charge your mobile phone, which can be described as both health and entertainment.

At present, daily life and work are almost inseparable from mobile phones. Of course, as the functions of smartphones become more powerful, the battery life is not in the same position compared to the previous traditional mobile phones.

With the birth of the power bank, it can be said to be the savior of ‘battery phobia’ for people who are away from home.

However, with the popularization of power banks, some unqualified products caught fire, exploded, and injured people frequently, which made people scared.

The Rocket Academy perfectly solved this problem and developed a unique ‘water cup-shaped power bank’ at home and abroad.

Just pour hot water into the cup to charge mobile phones, cameras, laptops, and other digital products at any time.

As a thermos cup, it is of moderate size and is just right to carry with you. It adopts a double-layer heat insulation cup sleeve and austenitic stainless steel liner.

At room temperature, the 6-hour heat preservation effect is above, and the 6-hour cold preservation effect is below 9℃.

As a power bank, you only need to pour hot water to convert heat energy into electrical energy to charge electronic devices.

Additionally, the lid can be turned over and connected to a power source to enable wireless charging. Even in the wild, you should start a small fire and boil some hot water to charge your phone.

According to space black technology, it uses high-performance thermoelectric conversion technology in the aerospace field and overcomes many problems such as the preparation process of high-performance thermal power generation chip components, and the effective temperature difference improvement technology of the chip based on enhanced interface thermal conductivity. Fire and explosion caused by overheating, exposure to the sun, short circuit, etc.

(Via)

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